Helmut Fischer – FISCHERSCOPE ® X-RAY SERIES
X-ray fluorescence for coating thickness measurement and material analysis.
Safe measuring devices that make you shine.
Want the best measuring devices for your quality control? Then FISCHERSCOPE® X-RAY XRF measuring instruments are exactly what you need. Precise, fast, reliable and durable: Measure coating thicknesses and analyze materials non-destructively, contact-free and conveniently. The instruments are easy to use and suitable for almost any application.
Discover our large product portfolio with numerous benchtop instruments, a handheld device, (partially) automated X-ray measuring solutions as well as special solutions. Thanks to our powerful and comprehensive WinFTM® software, data transfer, data evaluation and data export are more efficient than ever.
Application Examples
SIGMASCOPE® GOLD B
- Non-destructive testing of gold bars from approx. 1 oz (31.1 g) to 1 kg
- Detection of base inclusions (e.g. tungsten)
SIGMASCOPE® GOLD C
- Non-destructive testing of gold coins and bars up to approx. 100 g
- Testing the gold alloys of coins
- Identification of commercially available precious metal coins such as Krugerrands, ducats etc. based on the specific conductivity values
Key Features
- X-ray optics made by Fischer. As one of only two manufacturers of polycapillary
- optics worldwide, we enable X-rays to be focused on a very small measuring spot
- Market-leading software. The world’s most powerful application software for coating thickness measurement and material analysis
- Powerful Detectors. Choice of three different detector types for the optimal solution of your measurement task. proportional counter tube, silicon PIN diode and silicon drift detector
- Particularly safe. Full-protection instruments in accordance with current radiation protection legislation
- Comprehensive service. From personal advice and preventive maintenance, including repair and spare parts management, to training on site
- Long-lasting X-ray tubes. Selection of different X-ray tubes
- for optimal measurements of your application
- User-friendly. Proven and intuitive operating concept for easy handling of the device
Application
Many applications, a solution for everyone
Printed circuit boards: Our XRF systems comply with the IPC-4552-A/B and IPC-4556 standards. The measurement results are accurate and reproducible for the
specified thickness range. HASL, electroless nickel and other critical coating systems can be measured quickly and accurately.
Electronic components: Reliably control electroniccomponents, such as compositions and layer thicknesses of lead-free solders during reflow soldering and analyses on SMD components.
Lead frames: Determine the layer thickness and composition of complex multilayer coating systems on lead frames with repeatability and non-destructive accuracy.
Large components: Our instruments offer you the possibility o measure large samples quickly and reliably.
Tools: Hard coatings only function efficiently as wear protection if the coating thickness, composition and surface hardness are correct. Testing instruments from Fischer use various methods, such as X-ray fluorescence, to precisely determine the coating thickness of TiN coatings and other hard metals or carbide coatings.
Connector contacts: Functional surfaces on connector contacts from a size of approx. 20 μm can be measured precisely and non-destructively. These could be, for
example, contact points, crimping surfaces or press-fit zones.
Metal finishing: Measure the coating thickness and composition of the corrosion protection layer non-destructively and reliable. Our instruments also determine
the metal concentration in your electroplating bath easily and with high precision.
Semiconductor / Wafer: Clean room suitable, fast andprecise XRF measuring instruments for layer thickness measurement and structural analysis of modern
2.5D-/3D-packaging solutions. The instruments are available as benchtop or fully automated.
Jewelry: Whether in the watch industry, in the gold trade or in the jewelry sector – wherever precious metals are used, Fischer instruments have proven their worth
thanks to non-destructive and highly precise measurements.
Sanitary: Clear results in a short time: Precise measurement of all common multilayer systems. In our product portfolio of X-ray fluorescence analysis instruments, we
have just the right instrument for you.
RoHS: Measuring instruments for the detection of lowest concentrations of heavy metals thanks to the sensitive silicon drift detectors. The measuring process is non-contact, non-destructive and simple. In addition, our measuring instruments offer a wide range of options for documenting the measurement results and generating reports. Our instruments measure quickly compared to chemical analysis and are excellent for screening.
Decorative chromium coatings: To ensure that trim is visually flawless not only at delivery but also after years of use, the layer structure must be monitored with regard to the thicknesses of the individual layers.
Available Models
The high-end all-rounder.
FISCHERSCOPE® X-RAY XDV®-SDD models are among the most powerful X-ray instruments. Their silicon drift detector is extremely sensitive to fluorescence radiation of light elements. This permits very low detection limits as well as measurement applications relating to NiP, RoHS and very thin layers < 0.05 μm. This is why the universal XDV®-SDD instrument performs exceedingly well in research and development, laboratory and process qualification settings. Also, its ease of use makes it indispensable in production control.
Features
- Universal instrument for the determination of pollutants in the smallest concentrations according to RoHS and for automated measurements of layers, including < 0.05 μm
- Stepless measuring distance with measuring top down
- Microfocus tube with tungsten anode, other anodes as options available
- 4-fold changeable apertures
- 6-fold changeable filter
- Silicon drift detector 50 mm² for highest precision on thin layers
- Aperture (collimator) up to 3 mm: Highest intensity for shortest measuring time even with difficult samples (thinnest coatings, Si wafers, conversion layers), light
- elements (fuel cells, Al components)
- Programmable measuring stage for automated measurements on small structures
- Fully protected instrument with type approval according to current radiation protection legislation
Smallest measuring surface, highest precision.
The FISCHERSCOPE® X-RAY XDV®-μ instruments formFischer’s high-end X-ray fluorescence series, designed for precise coating thickness measurement and material analysis on tiny structures. The instruments are equipped with powerful silicon drift detectors and polycapillary optics, which drastically reduce measuring times and enable repeatable measurements due to the high radiation intensity.
The XDV®-μ instruments are used in particular for applications in the electronics and semiconductor industry such as the measurement of very small structures, e. g. bond surfaces, SMD components or thin wires.
Features
- Universal instruments for measurements on smallest components and structures as well as complex multilayer systems
- Stepless measuring distance with measuring top down
- Microfocus tube Ultra with tungsten anode for even higher performance on smallest spots with μ-XRF; molybdenumanode optional
- 4-fold changeable filter
- Polycapillary optics allow particularly small measuring spots of 10 or 20 μm half-width with short measuring times and high intensity
- Silicon drift detector 20 or 50 mm² for highest precision on thin layers ∙ Video system with 3x optical zoom for precise sample positioning
- Precise programmable measuring table for automated measurements on small structures
The specialist for field duty.
Despite its small size, the FISCHERSCOPE® X-RAY XAN® 500 is in no way second to laboratory equipment. The modern silicon drift detector is capable of accurate and precise measurement results with short measuring times. Even complex measuring tasks involving multiple layers are performed reliably – and quickly. How? The compact device detects thickness and composition of the
layer in a single measuring step.
Features
- Mobile and universal handheld instrument for precise coating thickness measurement and material analysis – even with difficult material combinations
- Weight 1.9 kg ∙ Up to six hours operating time with one battery charge
- Portable measurement box transforms the system into a XRF benchtop instrument
- Air cooled mini X-ray tube
- Fixed aperture
- Measuring spot Ø 3 mm
- Silicon drift detector for highest precision on thin layers
- Data evaluation via Bluetooth connection with full WinFTM® software
- Capable of bath analysis; liquid measuring cell is available option ∙ For outdoor use with IP54 protection rating
Your ticket into automated measurement.
The FISCHERSCOPE® X-RAY XDL® and XDLM® instruments are closely related to the FISCHERSCOPE® X-RAY XULM®. While the detectors, X-ray tubes, apertures and filter combinations are identical with the XULM®, the XDL® and XDLM® devices measure top down. Ideally suited for the inspection of galvanized mass-produced parts and bath analysis, the XDL® and XDLM® devices offer various measuring table options. The latter can be used for automated series testing.
While the XDL® device has a standard X-ray tube, its sister model XDLM® is equipped with a microfocus tube and changeable apertures and primary filters. It is the best choice for inspecting many small parts in succession. That is why the device is also used in the electronics industry. With a variable measuring distance of 0 mm to 8 mm, it enables reliable measurement of non-planar parts, such as plug contacts.
Features
- Universal instrument for measurements on galvanic mass-produced parts
- Stepless measuring distance with measuring top down
- Standard X-ray tube (XDL®); microfocus tube (XDLM®)
- 4-fold changeable apertures (XDLM®)
- 3-fold changeable filter (XDLM®)
- Proportional counter tube detector for short measuring times and small measuring spot
- Various measuring table options; models with extended sample support
- Fully protected instrument with type approval according to current radiation protection legislation
The best detectors for thin layers.
With its semiconductor detectors and the programmable measuring table, the FISCHERSCOPE® X-RAY XDAL® series is an excellent choice for fast and accurate measurements of solder composition. This makes it possible to eliminate the risk of getting different solder batches via a simple scan at incoming goods inspection.
The XDAL® series is also well suited for applications that require testing thin and ultra-thin coatings < 0.05 μm. This allows, for example, expensive materials to be saved and process-reliable production to be carried out. Mass inspection of different components in production control and incoming goods can also be completed.
The instrument version with a 50 mm² silicon drift detector is suitable for RoHS measurements.
Features
- Universal instrument for automated measurements of thin and very thin layers < 0.05 μm and for material analysis in the ppm range
- Stepless measuring distance with measuring top down
- Microfocus tube with tungsten anode
- 4-fold changeable apertures
- 3-fold changeable filter
- Various semiconductor detectors ensure very good detection accuracy and high resolution: silicon PIN and silicon drift detector
- Optionally also available with fixed or manual measuring table
- Fully protected instrument with type approval according to current radiation protection legislation
Cutting-edge technology for wafer applications.
Wafers place some of the highest demands on the measurement technology used. On the one hand, the surfaces are very sensitive, on the other hand, the structures are so small that only special devices can analyze them.
FISCHERSCOPE® X-RAY XDV®-μ WAFER model is specialized in the analysis of microstructures and the growing requirements of the semiconductor industry. The device is available as a stand-alone version or integrated into a fully automated measurement system (FISCHERSCOPE® X-RAY XDV®-μ SEMI). Typical measuring tasks include the characterization of base metallizations, material analysis of solder bumps and coating thickness measurement on contact surfaces.
Testing of such tiny structures requires minuscule measuring spots. That is why XDV®-μ WAFER instruments are equipped with polycapillary optics. They focus the X-ray onto a measuring spot of just 10 – 20 μm. A XDV®-μ WAFER system thus allows for much more precise characterization of the individual microstructures than any conventional instruments can.
Features
- Special instrument for automated measurements of thin layers and multilayer systems on wafers with diameters from 6 – 12 inches ∙ Stepless measuring distance with measuring top down
- Microfocus tube Ultra with tungsten anode for even higher performance on smallest spots with μ-XRF; molybdenumanode optional
- 4-fold changeable filter
- Polycapillary optics allow particularly small measuring spots of 10 or 20 μm half-width with short measuring times and high intensity
- Silicon drift detector 20 mm² or 50 mm² for highest precision on thin layers
- Vacuum stage with holders for all standard wafer formats from 150 – 300 mm
- Up to 5 mm sample height possible
- Extensive automation options with WinFTM®
Technical Specification
| Product Family | Measuring Direction | Short Characteristics | Detector | Primary Filter | Apertures | Aperture Type/ Size | C-slot |
| XDV®-SDD | Measuring top down | Powerful measuring device for universal use for the inspection of very thin or complex layers up to RoHS screening at very low detection limits | SDD | 6 | 4 | Ø 0.2 / 0.6 / 1 / 3 mm* | – |
| XDV®-μ | Measuring top down | Model series optimized for microanalysis for measurement on smallest components and structures; also for checking complex multilayer systems; special solutions for wafers, lead frames and printed circuit boards possible | SDD | 4 | Polycapillary optics | Ø 20 μm Standard** | Yes |
| XAN® 500 | Mobile measuring | Flexible handheld instrument for precise coating thickness measurement and material analysis on bulky parts or in hard-to-reach places | SDD | 1 | 1 | Ø 2 mm | – |
| XDL® | Measuring top down | Robust instrument for quality control of galvanized bulk parts and for bath analysis | Proportional counter tube | 1 | 1 | Ø 0.3 mm* | Yes |
| XDLM® | Measuring top down | Universal instruments for the inspection of small parts and small structures, for example in the electronics industry, for measurements of light metals, hard coatings and thin electroplated coatings; special solutions for printed circuit boards possible | Proportional counter tube | 3 | 4 | Ø 0.1 / 0.2 mm 0.05 × 0.05 mm; 0.2 × 0.03 mm* Ø 0.1 mm* | Yes |
| XDAL® | Measuring top down | Model series for applications in the area of thin and very thin coatings; also for material analysis (e. g. RoHS screening); special solutions for printed circuit boards possible SDD version with high count rates for highest precision and shorter measuring times | PIN | 3 | 4 | Ø 0.1 / 0.3 / 0.6 mm 0.5 × 0.15 mm* | Yes |
| XDV®-μ WAFER | Measuring top down | Model series optimized for microanalysis for measurement on smallest components and structures; also for checking complex multilayer systems; special solutions for wafers, lead frames and printed circuit boards possible | SDD | 4 | Polycapillary Optics | Ø 20 μm Standard** Ø 20 μm halofree** Ø 10 μm halofree** Ø 60 μm halofree** Ø 50 μm halofree** | Yes |
Unlock Precision: Redefining Measurement Technology Worldwide | Fischer
Fischer is a leading specialist in material analysis, coating thickness measurement and material testing since 1953. We offer a wide…
